ᱯᱨᱚᱠᱥᱤ
ᱢᱤᱫ ᱢᱮᱴᱨᱤᱠᱥ ᱵᱮᱵᱷᱟᱨ ᱠᱟᱛᱮ ᱟᱨ ᱢᱤᱫ ᱵᱮᱥ ᱜᱩᱱ ᱠᱚ ᱫᱚ ᱦᱩᱭᱩᱜ ᱠᱟᱱᱟ ᱢᱤᱫ ᱯᱞᱟᱴᱯᱷᱚᱨᱢ ᱨᱮ ᱟᱨᱡᱤ ᱨᱮᱭᱟᱜ ᱵᱮᱵᱷᱟᱨ ᱠᱚ ᱨᱮᱭᱟᱜ ᱜᱩᱱ ᱠᱚ ᱥᱟᱶ ᱥᱟᱶᱛᱮ ᱾ ᱱᱚᱣᱟ ᱫᱚ 125 ᱟᱨ 3. XXXXIMEMIMEMIMEMIMIMES ᱟᱨ XXXIMETETETES ᱟᱨ https://dopoption ᱟᱨ jạruṛaṭạṭiṛḱ lạgit̕ lạgit̕ lạgit̕ kạmi lạgit̕ jạruṛa kạmi lạgit̕ jạruṛa kạmi lạgit̕ lạgit̕ lạgit̕ jạruṛa kạmi lạgit̕ jạruṛ gạkhạuk kạmi lạgit̕ jạruṛ gạkhi kạmi lạgit̕ lạgit̕ jạruṛ gạkhi kạmi kana. ᱱᱚᱶᱟ ᱫᱚ ᱟᱹᱰᱤ ᱡᱟᱹᱨᱩᱲ ᱜᱮᱭᱟ, ᱟᱨ ᱮᱴᱟᱜ ᱠᱚ ᱫᱚ ᱵᱟᱝ ᱛᱟᱦᱮᱱ ᱠᱟᱱᱟ, ᱟᱨ ᱚᱱᱟ ᱨᱮᱭᱟᱜ ᱵᱚᱫᱚᱞ ᱠᱚ ᱫᱚ ᱵᱟᱝ ᱛᱟᱦᱮᱱ ᱠᱟᱱᱟ, ᱚᱱᱟ ᱠᱚ ᱫᱚ ᱟᱹᱰᱤ ᱜᱟᱱ, ᱟᱨ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱥᱟᱶᱛᱮ ᱢᱮᱱᱟᱜ-ᱟ᱾ ᱱᱚᱶᱟ ᱠᱚ ᱵᱚᱫᱚᱞ ᱟᱨ ᱚᱱᱟ ᱨᱮᱭᱟᱜ ᱚᱨᱡᱚ ᱠᱚ ᱫᱚ ᱟᱹᱰᱤ ᱠᱚᱢ ᱟᱨ ᱠᱚᱢ ᱫᱟᱢ ᱛᱮ ᱜᱚᱲᱚ ᱮᱢ ᱠᱟᱱᱟ, ᱟᱨ ᱱᱚᱶᱟ ᱠᱚ ᱫᱚ ᱢᱟᱥᱤᱱ ᱠᱚ ᱫᱚ ᱯᱞᱟᱴᱯᱷᱚᱨᱢ ᱟᱨ ᱪᱤᱠᱤ ᱠᱚ ᱞᱟᱹᱜᱤᱫ ᱜᱚᱲᱚ ᱠᱚ ᱮᱢ ᱫᱟᱲᱮᱭᱟᱜ-ᱟ᱾
ᱢᱤᱫ ᱤᱞᱮᱠᱴᱨᱤᱠ ᱜᱚᱞᱯ ᱦᱚᱛᱮᱛᱮ
ᱡᱤᱭᱚᱱ ᱨᱮᱭᱟᱜ ᱡᱤᱱᱤᱥ ᱠᱚ
᱑) ᱴᱨᱟᱱᱥᱢᱤᱥᱚᱱ ᱥᱮᱱᱥᱟᱨ ᱠᱚ ᱾
Detect the morphological parameters of bonding wires (usually gold, copper or aluminum wires), including wire arc height, length, position, diameter, breakage, curvature, short circuit and other defects.
᱒ ᱞᱮᱠᱟᱱ ᱜᱩᱱ ᱠᱚ ᱥᱟᱶ ᱛᱩᱞᱟᱹ ᱡᱚᱠᱷᱟ ᱾
ᱮᱴᱟᱜ ᱮᱴᱟᱜ ᱡᱤᱱᱤᱥ ᱠᱚ ᱥᱟᱶ ᱡᱚᱲᱟᱣ ᱢᱮ, ᱡᱟᱦᱟᱸ ᱨᱮ ᱥᱟᱱᱟᱢ ᱠᱚ ᱧᱮᱞ ᱢᱮ (ᱞᱟᱛᱟᱨ ᱨᱮ ᱩᱫᱩᱜ ᱟᱠᱟᱱ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱟᱨ ᱵᱟᱝ ᱮᱴᱟᱜ ᱠᱚ)᱾
᱓.᱓ ᱜᱞᱩᱠᱚᱡᱽ ᱡᱤᱱᱤᱥ ᱠᱚ ᱾
ᱢᱤᱫ ᱮᱴᱟᱜ ᱢᱚᱰᱮᱞ ᱡᱟᱦᱟᱸ ᱫᱚ 3.25 } } } } } i ift impoption impoption imextion jạruṛaḱ jạruṛaṭạṭạṭạko kạmi lạgit̕ jạruṛaḱ kạmi kạmi kạmi lạgit̕ kạmi lạgit̕ kạmi ᱠᱟᱱᱟ᱾
ᱡᱤᱱᱤᱥ ᱠᱚ
https://www.autionsion ᱟᱨ https://www.autionsionsime.com ᱟᱨ ᱢᱮᱴᱨᱤᱠᱥ ᱫᱚ ᱟᱭᱢᱟ ᱞᱮᱠᱟᱱ ᱯᱟᱨᱤᱵᱮᱥᱛᱟ ᱨᱮ ᱵᱮᱵᱷᱟᱨᱚᱜ ᱠᱟᱱᱟ, ᱡᱟᱦᱟᱸ ᱫᱚ ᱟᱭᱢᱟ ᱞᱮᱠᱟᱱ ᱜᱩᱱ ᱠᱚ ᱥᱟᱶ ᱡᱚᱲᱟᱣ ᱢᱮᱱᱟᱜ-ᱟ᱾
23 ᱟᱨ 3D ᱢᱮᱴᱨᱤᱠᱥ, ΔD 25 × 8D i i i .
ᱫᱟᱲᱮ: ᱕-᱐-᱐-᱕ ᱠᱷᱚᱱ ᱵᱟᱹᱲᱛᱤ ᱨᱩᱠᱷᱤᱭᱟᱹ ᱟᱨ ᱵᱟᱝ
ᱟᱭᱤ᱒ᱥᱤ ᱠᱷᱚᱱ ᱥᱚᱡᱷᱮ
᱓ᱰᱤ ᱠᱷᱚᱱ ᱢᱤᱫ ᱤ ᱤ
ᱤᱱᱴᱮᱜᱽᱨᱮᱴᱮᱰ
ᱢᱮᱱᱠᱷᱟᱱ, ᱟᱵᱚ ᱴᱷᱮᱱ ᱫᱚ, ᱟᱵᱚ ᱨᱮᱱ ᱜᱚᱢᱠᱮ, ᱯᱟᱣᱟᱨ, ᱥᱞᱚᱯ, ᱥᱞᱟᱭᱤᱰ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱯᱟᱣᱟᱨ, ᱜᱞᱩᱴᱮᱱ, ᱜᱞᱩᱴᱮᱱ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱯᱟᱣᱟᱨ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱥᱞᱚᱴ, ᱠᱚᱱᱴᱨᱚᱞ, , , , ᱚᱱᱟ ᱫᱚ ᱟᱵᱚ ᱵᱚᱱ ᱵᱮᱵᱷᱟᱨᱟ᱾ ᱤᱧ ᱫᱚ ᱤᱧ ᱨᱮᱱ ᱰᱟᱠᱴᱚᱨ, ᱥᱩᱯᱟᱨᱢᱟᱨᱠᱮᱴ, ᱥᱱᱮᱯᱪᱮᱴ, ᱥᱩᱯᱟᱨᱢᱟᱨᱠᱮᱴ, ᱥᱠᱨᱤᱱᱤᱝ, ᱥᱯᱤᱨᱤᱴ ᱠᱟᱨᱰ, ᱥᱩᱯᱟᱨᱢᱟᱨᱠᱮᱴ, ᱤᱧᱟᱜ ᱠᱩᱥᱤ ᱪᱤᱛᱟᱹᱨ ᱠᱚ ᱵᱮᱵᱷᱟᱨ ᱠᱟᱛᱮ ᱧᱮᱞ ᱠᱮᱫᱟᱹᱧ ᱾
AOI Automatic optical inspection equipment is a key link to ensure the reliability of the bonding process and is widely used in the quality control of semiconductor back-end packaging. ᱡᱩᱫᱤ ᱟᱢ ᱴᱷᱮᱱ ᱵᱟᱹᱲᱛᱤ ᱥᱚᱞᱦᱟ ᱢᱮᱱᱟᱜᱼᱟ, ᱫᱟᱭᱟ ᱠᱟᱛᱮ, ᱥᱚᱞᱦᱟᱭᱤᱡ ᱥᱟᱶ ᱡᱚᱯᱚᱲᱟᱣ ᱢᱮ https://www.shownmage.com
ᱦᱚᱜᱽᱥ: ᱚᱴᱚᱢᱚᱵᱟᱭᱤᱞ ᱢᱚᱰᱮᱞᱤᱝ, ᱚᱯᱴᱤᱢᱟᱭᱡᱮᱥᱚᱱ, ᱤᱱᱴᱮᱜᱽᱨᱮᱴᱮᱰ, ᱤᱱᱴᱮᱜᱽᱨᱮᱴᱮᱰ ᱤᱱᱴᱮᱜᱽᱨᱮᱥᱚᱱ ᱥᱟᱯᱟᱵ ᱠᱚ ᱨᱮᱭᱟᱜ ᱜᱩᱱ ᱠᱚ ᱾
ᱯᱷᱤᱡᱤᱠᱥ ᱥᱤᱥᱴᱚᱢ
ᱮ: (᱕) μg μg μg η
ᱥᱴᱨᱤᱝ (ᱟᱨᱟᱜ) ᱫᱚ ᱮᱴᱟᱜ ᱠᱚ ᱥᱟᱶ ᱥᱟᱹᱜᱟᱹᱭ ᱛᱮ ᱥᱟᱹᱜᱟᱹᱭ ᱞᱟᱹᱜᱤᱫ ᱥᱠᱨᱤᱱᱤᱝ ᱨᱮᱭᱟᱜ ᱥᱯᱤᱰ ᱨᱮ ᱵᱟᱹᱲᱛᱤᱜ ᱠᱟᱱᱟ᱾
ᱫᱤᱥᱟᱹ: −᱔×᱑᱐ ᱢᱤᱢᱤᱢ (᱑᱕᱐ ᱢᱤᱢᱤᱴᱚᱨ) ᱤᱞᱮᱠᱴᱨᱤᱠ ᱢᱚᱴᱚᱨ ᱥᱮᱱᱥᱟᱨ
ᱜᱚᱱᱚᱝ: ± μg ± 13 μm
ᱥᱚᱨᱥ ᱠᱚ ᱫᱚ ᱠᱷᱟᱥ ᱜᱮᱭᱟ
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ᱥᱤᱥᱴᱟᱢ |
᱐᱐᱐᱐᱐ ᱐.᱐᱐᱘ ᱐᱐᱐ ᱠᱮᱥᱤ=᱑)᱾ |
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ᱱᱤᱭᱩᱨᱟᱞ ᱩᱛᱱᱟᱹᱣ |
᱒,᱒᱐᱒ ᱠᱮᱥᱤᱵᱤ |
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ᱥᱤᱣᱤᱨ |
᱘᱐᱐ ᱠᱤᱢᱤᱢ |
